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Mr Ahmed Sharif, a PhD student of the Department of Electronic Engineering, won the IEEE CPMT Young Award for his research paper on lead-free solder.
The Centre for Electronic Packaging and Assemblies, Failure Analysis and Reliability Engineering (EPA Centre) was accredited in December 2003 by the Hong Kong Accreditation Service (HKAS) for its Ionic Analysis of Circuit Board, Ion Chromatography Method.
On 21 November, CityU's Centre for Electronic Packaging and Assemblies, Failure Analysis and Reliability Engineering (the EPA Centre) was accepted by the Hong Kong Accreditation Service (HKAS) as an Accredited Laboratory* under the Hong Kong Laboratory Accreditation Scheme (HOKLAS). This is a CityU first.