Ultra-precision copper lattice structures with spatially optimised topology for highly efficient cooling of microelectronic devices
Pure copper 3D printing is the future of thermal management in microelectronics due to improved functionality and heat transfer with complete freedom of geometric shape. In this project, we used a computationally efficient deep learning-based tool to accelerate topology optimisation and lattice structure design. Combined with our ultra-high precision and low-cost pure copper additive manufacturing technology, we can freely create a 3D geometric lattice structure with feature size down to 70um for high-performance thermal management applications. As a result, we can produce microchannels, micropillars and micropipes that can be used to distribute and remove fluid efficiently, potentially reducing internal pressure drops and demonstrating extremely high market value in the semiconductor and microelectronics industries.
Mr Wang Liqiang* (PhD student, Dept. of Mechanical Engineering, CityU)
Mr Qu Shuo (The Chinese University of Hong Kong)
Mr Tao Quanqing (The Chinese University of Hong Kong)
Dr Wang Xiong (Postdoc, Dept. of Mechanical Engineering, CityU)
* Person-in-charge
(Info based on the team's application form)
- CityU HK Tech 300 Seed Fund (2024)